Meaning
Differential concentrations of water vapor trapped within the layers of a printed circuit board or a plastic enclosure create internal stresses that affect mechanical stability. A moisture gradient develops when the exterior surface of a component dries or hydrates faster than its core, often during rapid environmental testing or high temperature soldering. Controlling this imbalance prevents the internal pressure buildup that causes catastrophic delamination during the assembly process.
Diffusion Rate
Movement of moisture through a material is a slow process governed by the temperature and the porosity of the substance. During a bake out cycle, the outer layers dry quickly while the center remains saturated.
Delamination Risk
Rapid heating causes trapped water to turn into steam instantly. If the moisture level at the center of a board is high, the resulting pressure forces the fiberglass layers apart. This phenomenon is frequently observed during lead-free reflow where peak temperatures are high.
Material Expansion
Absorption of water causes the polymer matrix of a circuit board to swell in all directions. A non-uniform moisture profile leads to uneven expansion across the thickness of the material. Uneven expansion of this type can misalign tiny vias and break delicate internal connections.