Meaning
Plated through-holes located at the edge of a printed circuit board facilitate surface mounting of one board onto another as a modular component. These castellated vias appear as half-circles after the board edge is routed through the center of the plated holes. Connection points created this way allow the sub-assembly to function as an integrated chip package during system manufacturing.
Soldering Interface
Mechanical stability depends on the formation of a reliable solder fillet between the vertical pad and the host footprint. The castellated vias provide a visible joint that simplifies inspection and repair of wireless modules or sensor boards. Surface tension pulls the solder into the hollow cavity to create a bridge.
Fabrication Sequence
Specialized routing techniques prevent the copper from peeling away when the bit cuts through the plated hole. Manufacturers often plate these castellated vias twice to ensure the metal wall remains intact during the final separation. Quality boards exhibit clean edges without burrs that might interfere with the seated height of the module.
System Integration
Designers use these side-mount contacts to minimize the vertical profile of the final product. Eliminating traditional pin headers reduces the total height of the enclosure when using castellated vias. The flat bottom of the module rests directly against the main motherboard, which improves thermal transfer and electrical grounding across the interface.
The module sits flush against the carrier board.