Meaning
Atmospheric reaction produces liquid corrosive agents from gas-phase precursors when the temperature of a surface drops below the dew point. In electronic packaging, volatile acid condensation occurs when outgassed vapors from adhesives or plastics react with moisture to form organic acids. These liquids settle on lead frames and bond wires to initiate galvanic corrosion.
Chemical Reaction
Vapors containing acetic or formic acid molecules originate from the incomplete curing of epoxy resins. When these molecules reach a cool metallic surface, they transition from a gas to a concentrated liquid film.
Packaging Risk
Small enclosures with high power density are susceptible to this mechanism during power cycling. As the device cools after a period of activity, internal surfaces reach the threshold where the acid vapors condense. Moisture ingress through the mold compound provides the aqueous medium necessary for the reaction.
Identifying the outgassing profiles of internal materials is a primary step in mitigating the long-term risk of chemical decay.
Temperature Variation
Seasonal humidity shifts and rapid thermal transitions increase the rate of liquid formation. One effective way to mitigate the risk involves selecting low-outgassing materials that do not release acidic precursors during the service life of the assembly. Protective coatings can also shield sensitive trace geometries from direct contact with the condensed fluids.
Designers often use thermal modeling to predict where condensation is most likely to occur within the enclosure.