Meaning
Proportional measurements quantify the physical damage sustained by fragile components during assembly and transit. A high breakage rate indicates that the pick-and-place machine calibration is incorrect or that the ceramic substrates are too thin for the mechanical handling steps. This metric applies to mechanical failures on the production line and does not track electronic failures.
Yield Impact
Financial losses increase when delicate sensors or displays are damaged beyond repair before the final testing phase. Calculating the breakage rate helps production managers adjust their raw material orders to account for expected losses during the mounting process. If the rate exceeds the planned threshold, the assembly line is halted to prevent further component loss.
Root Cause
Structural analysis of fractured circuit boards often points to excessive mechanical pressure or poor packaging design. The breakage rate rises when silicon dies are subjected to sudden thermal changes during the reflow soldering process. Engineers use high-speed cameras to monitor the nozzle pressure and identify where the mechanical stress originates.
This diagnostic approach separates issues caused by incorrect machine settings from defects inherent in the incoming wafers.
Preventative Measure
Modifying the carrier trays and optimizing the nozzle speed reduces the occurrence of physical fractures. Replacing rigid plastic holders with anti-static foam inserts protects the delicate radio frequency boards during internal transport. Regular calibration of the robotic arms ensures that components are placed with the correct force.