Chipset End of Life Notices and the Redesign Clock
A silicon end-of-life notice demands an immediate audit of last-time-buy volumes against redesign lead times to prevent production gaps during recertification.
Dry Baking Requirements
Meaning
Environmental processing standard used to remove moisture from surface mount devices before high temperature reflow soldering. Adherence to dry baking requirements prevents internal delamination and the popcorn effect caused by the rapid expansion of trapped water vapor. The process stops once the component reaches a state of minimum moisture content defined by its sensitivity level.
Standardized Procedure
Temperature and duration for the process depend on the thickness of the component and the moisture sensitivity level. Thinner packages typically require shorter bake times at 125 degrees celsius to reach a safe state.
Exposure Limit
Tracking the time a part spends outside of its moisture barrier bag is a mandatory part of the assembly floor control. If the floor life expires, the components must undergo a bake cycle to reset the internal moisture clock. Overheating parts for too long leads to oxidation of the leads and reduces the reliability of the metallurgical bond.
Floor Recovery
Storing components in a low humidity dry cabinet prevents the reabsorption of moisture after the bake cycle is complete. This environment maintains the dry state of the parts until the production line is ready for placement. Proper handling ensures that the structural integrity of the plastic package remains intact during the thermal stress of reflow.