Dye and Pry Failure Analysis

Inspection Procedure

Technicians submerge the target area in a low viscosity dye and place the assembly in a vacuum chamber to ensure the fluid reaches every internal void. Once the dye has dried, the component is pried away using a calibrated tool to prevent the creation of new fractures during removal. Dye and pry failure analysis provides a clear visual record of the pre-existing damage.

Inspectors then examine the separated surfaces under a microscope to classify the type of failure.

Defect Identification

Solder joint failures often appear as head-in-pillow defects or brittle interfacial fractures. Because the dye only marks the surfaces that were already separated, dye and pry failure analysis distinguishes between manufacturing defects and damage caused by the prying process itself. Solder balls that are completely covered in dye were entirely disconnected, while those with no dye were fully intact.

This method is useful for analyzing large ball grid arrays where center pins are difficult to inspect.

Root Cause

Data gathered from this process informs adjustments to the reflow profile or the mechanical design of the enclosure. If dye and pry failure analysis reveals consistent cracking at the corners of a package, it suggests excessive board flexure or thermal expansion mismatch. Corrective actions might include adding structural support, changing the solder alloy, using underfill or modifying the board thickness.

Quality teams use these findings to validate the reliability of new assembly processes and to verify the effectiveness of shipping containers.