Meaning
Production metrics evaluate the efficiency of repairing defective electronic boards and the rate of scrapped materials on the factory floor. Monitoring rework yield scrap helps manufacturing managers calculate the true cost of assembly defects and identify process bottlenecks. This metric tracks the percentage of boards that are successfully repaired compared to those that must be discarded.
The data is used to optimize oven profiles and printer settings to reduce future defects.
Yield Impact
High rates of rework can damage delicate copper traces and solder pads, rendering the board unusable. If a repaired board fails its post-rework testing, it must be scrapped, which increases the total cost of production. This outcome reduces the overall efficiency of the manufacturing line.
Recovery Efficiency
Scrap reduction programs focus on training technicians and using automated rework stations to improve the success rate of repairs. Precise thermal control during component removal prevents adjacent components from being damaged. This precision ensures that a high percentage of boards are recovered.
Financial Cost
Discarding assembled boards results in the loss of both raw materials and manufacturing time. The financial impact includes the cost of the circuit board, the microprocessors and the labor required to assemble them.
