Meaning
A reliability evaluation technique used to determine the long-term wearout characteristics of integrated circuits by subjecting them to elevated temperatures and operating voltages for an extended duration. This qualification procedure accelerates potential failure mechanisms to simulate years of field operation in a few hundred hours. By exposing connectivity modules or sensor packages to these extreme conditions, engineers can identify design and manufacturing flaws before mass production begins.
Test Execution
Silicon dies are mounted on specialized burn-in boards and placed inside a thermal chamber. Continuous electrical signals stimulate the internal gates of each device while the temperature is maintained above one hundred degrees Celsius. This active bias simulates the worst-case operating scenario for the internal circuitry.
Monitoring the power consumption during the test helps detect early latch up or dielectric breakdown.
Acceleration Factor
Calculations based on the Arrhenius equation determine the equivalent field life achieved during the test run. Increasing both the voltage and temperature allows a thousand-hour test to represent years of normal use.
Release Requirement
Successful completion of this testing is a mandatory step for product release. The results must demonstrate zero failures across the test lot to satisfy the requirements of the quality team.