Meaning
Electronic files that contain the three-dimensional geometry of components along with their material attributes simulate the behavior of printed boards. Through thermal step models, engineers can model the heat distribution of multi-chip modules during the layout phase. This format is supported by most electronic design and mechanical CAD software packages.
Design Integration
Creating a complete representation of the board requires importing these files into the PCB design environment. The use of thermal step models allows the mechanical engineer to verify the fit of the module inside the metal enclosure. This verification ensures that the heat dissipation pads on the board line up with the thermal pads on the housing.
This integration is standard in the design of rugged communication gateways.
Simulating Performance
Finite element analysis uses these geometry files to run complex simulations of heat flow. By using thermal step models, the software can calculate the temperature at each junction of the chip when it operates at maximum power. This simulation reveals if the component will exceed its rated temperature limits.
The results are used to adjust the spacing of high-power components on the board. Using these files ensures that the thermal pathways are optimized before the board is sent to assembly.
Manufacturing Application
Mechanical fit verification must occur before the manufacturer begins production of the metal housing. Incorrect thermal step models can lead to interference between the board and the casing, causing assembly delays. Accurate models ensure that the production run can proceed without costly modifications to the metal molds.
