Turnkey Module Source Schematic Handovers before NRE Payment Authorization
Schematic handovers before NRE release require full native CAD project files, netlists, and manufacturing data verified on the bench prior to invoice authorization.
Board Stackup Documentation
Meaning
Technical specifications define the arrangement of conductive copper layers and insulating dielectric materials within a multilayer printed circuit board. Comprehensive board stackup documentation provides the fabrication house with the exact thicknesses and material types required to achieve target impedance levels. This specification prevents variations in signal speed and crosstalk that could degrade high speed data transmission.
Material Selection
Core and prepreg layers are chosen based on their thermal stability and electrical characteristics. In the board stackup documentation, the designer specifies the glass transition temperature and dielectric constant for every non conductive sheet. These properties determine how the assembly will behave during the high heat of the reflow soldering process.
Impedance Profile
Specific trace widths are calculated to match the electrical properties of the selected materials for controlled impedance nets. The board stackup documentation includes a table showing the target ohms for differential pairs and single ended traces on each signal layer. Manufacturers use this data to adjust their etching processes to stay within the allowed tolerance.
Fabrication Tolerance
Limits on copper plating thickness and drill registration ensure the physical durability of the finished part. Within the board stackup documentation, the designer sets the minimum acceptable thickness for via walls and surface finishes. These values are checked against the finished product during the quality inspection at the factory.