Chipset End of Life Notices and the Redesign Clock
A silicon end-of-life notice demands an immediate audit of last-time-buy volumes against redesign lead times to prevent production gaps during recertification.
Solderability Degradation
Meaning
Surface quality decline that reduces the ability of a metallic contact to form a reliable metallurgical bond with molten solder. Exposure to humidity and oxygen leads to solderability degradation on component leads and printed circuit board pads. The process ends when the surface becomes so contaminated that it can no longer be wetted by the solder alloy during reflow.
Oxidation Process
Chemical reaction between the metal finish and the atmosphere creates a layer of non conductive oxides. This layer prevents the flux from reaching the underlying metal and results in weak or open joints.
Environmental Storage
Maintaining components in a controlled environment with low humidity and inert gas prevents the buildup of these contaminants. Parts kept in an open bin for several months are more likely to fail during the assembly process than those kept in a vacuum sealed bag.
Storage Solution
Re-tinning the leads or using a more aggressive flux can sometimes recover the parts, but this introduces additional thermal stress. Testing the solderability of a batch before it enters the production line ensures that the assembly yield remains high. A reliable bond is necessary to ensure the long term mechanical and electrical performance of the product.