Meaning
Specialized laminate material used for high frequency printed circuit boards that require low electrical loss. Using rogers 4003c substrate provides designers with a stable dielectric constant that remains consistent over a wide range of temperatures. The material specification applies to the raw laminate and prepreg used in the fabrication of the board.
Thermal Stability
Expansion and contraction of the board are minimized, which prevents the cracking of vias in harsh environments. Because rogers 4003c substrate has a thermal coefficient of expansion similar to copper, the mechanical stress on the traces is significantly reduced.
Material Performance
Signal integrity at microwave frequencies is superior to standard materials because of the low dissipation factor. Integrating rogers 4003c substrate into a design allows for more efficient power transfer and better sensitivity in the radio receiver.
Manufacturing Constraint
Handling these materials requires specific processing steps in the fabrication house to ensure the integrity of the layers. While rogers 4003c substrate is more expensive than general purpose laminates, the performance benefits for high speed wireless products justify the cost. The material is compatible with lead free soldering processes and can be used in multi-layer board constructions.
Precise control over the thickness and composition of the laminate ensures that every production batch meets the same tight electrical specifications. This material is a standard choice for high frequency radio integration.