Plastic deformation at 100 GHz contact asperities expands effective skin depth and adds up to 1.8 dB flange loss, collapsing sub-THz radio link margins.
Surface roughness forces high-frequency current through isolated micro-asperities, increasing contact resistance and insertion loss as skin depth shrinks.
Substrate moisture absorption increases dielectric loss tangent, raising RF interconnect insertion loss and reducing long-term wireless link margins.
RF micro-coaxial insertion loss escalates through skin-depth resistance, dielectric loss tangent shifts, mechanical flex displacement, and atmospheric oxidation.
Free-space W-band polymer testing requires precise spot-focused optics, strict sample thickness tolerances, and validated TRL calibration to prevent radome detuning and costly regulatory re-certification delays.
Mechanical preload across socket micro asperities defines insertion loss stability and constriction resistance in millimeter wave automated device testing.
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